Intshayelelo:Kuphuhliso lwangoku nolwangoku lweukukhanyaimboni, i-LED kunye ne-COB imithombo yokukhanya ngokungathandabuzekiyo zezona pearl zibalaseleyo. Ngeenzuzo zabo ezizodwa zobuchwepheshe, zikhuthaza ngokudibeneyo inkqubela phambili ye-industry.Eli nqaku liza kuhlolisisa ukungafani, inzuzo, kunye nokungonakali phakathi kwemithombo yokukhanya ye-COB kunye ne-LED, baphonononge amathuba kunye nemingeni abajongene nayo kwimeko yemarike yokukhanyisa yanamhlanje, kunye nefuthe labo kwiindlela zokuphuhlisa ishishini elizayo.
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PukumangalelaTiteknoloji: Tuyatsiba ukusuka kwiiyunithi ezidityanisiweyo ukuya kwiimodyuli ezidibeneyo
Umthombo wokukhanya we-LED yemveli
NgokwemveliUkukhanya kwe-LEDimithombo yamkela imowudi yokupakisha yetshiphu enye, equka iitshiphusi ze-LED, iingcingo zegolide, izibiyeli, umgubo wefluorescent, kunye neecolloids zokupakisha. I-chip igxininiswe ezantsi kwesibambi sekomityi ebonakalisayo kunye ne-adhesive conductive, kunye nocingo lwegolide ludibanisa i-electrode ye-chip kwi-pin holder. Umgubo we-fluorescent uxutywe kunye ne-silicone ukugubungela umphezulu we-chip ukuguqulwa kwe-spectral.
Le ndlela yokupakisha idale iifom ezahlukeneyo ezifana nokufakwa ngokuthe ngqo kunye nokunyuka komphezulu, kodwa ngokusisiseko kukudibanisa okuphindaphindiweyo kweeyunithi ezizimeleyo ezikhupha ukukhanya, njengeeperile ezisasazekileyo ezifuna ukudibaniswa ngononophelo kuthotho ukuze kukhanye. Nangona kunjalo, xa kusakhiwa umthombo wokukhanya omkhulu, ubunzima benkqubo ye-optical buyanda ngokukhawuleza, njengokwakhiwa kwesakhiwo esihle esifuna abantu abaninzi kunye nezixhobo eziphathekayo ukudibanisa kunye nokudibanisa isitena ngasinye kunye nelitye.
Umthombo wokukhanya we-COB
COB ukukhanyaimithombo igqobhoze iparadigm yemveli yokupakisha kwaye isebenzise itekhnoloji yokudibanisa itshiphu eninzi ngokuthe ngqo ukubophelela ngokuthe ngqo amashumi ukuya kumawaka eetshiphusi ze-LED kwiibhodi zesekethe ezisekelwe kwisinyithi eziprintiweyo okanye i-ceramic substrates.Iitshiphusi ziqhagamshelwe ngombane ngokusebenzisa iingcingo ezixineneyo eziphezulu, kwaye umphezulu wokukhanya we-luminescent wenziwa ngokugquma umaleko wesilicon yonke equlathe umgubo we-amberescent ufana nomgubo we-amberescent, ufana nomgubo we-amberescent. Izikhewu zomzimba phakathi kwee-LED zomntu ngamnye kunye nokufezekiswa koyilo lwentsebenziswano lwe-optics kunye ne-thermodynamics.
Ngokomzekelo, i-Lumileds LUXION COB isebenzisa iteknoloji ye-eutectic soldering ukudibanisa i-chips ze-121 0.5W kwi-substrate ejikelezayo kunye nobubanzi be-19mm, kunye namandla apheleleyo angama-60W. I-chip spacing ixinzelelwe kwi-0.3mm, kwaye ngoncedo lwe-cavity ekhethekileyo ebonakalisayo, ukufana kokusabalalisa ukukhanya kudlula i-90%. Oku kupakishwa okuhlanganisiweyo akugcini nje ukwenza lula inkqubo yokuvelisa, kodwa kudala uhlobo olutsha "lomthombo wokukhanya njengemodyuli", ukubonelela ngesiseko soguqukoukukhanyauyilo, kanye njengokubonelela ngeemodyuli ezenziwe kwangaphambili ezigqibeleleyo zabayili bokukhanyisa, kuphucula kakhulu ukusebenza koyilo kunye nemveliso.
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Iimpawu ezibonakalayo:Utshintsho ukusukaindawo ukukhanyaumthombo kumthombo wokukhanya ongaphezulu
I-LED enye
I-LED enye ngokusisiseko ingumthombo wokukhanya weLambertian, okhupha ukukhanya kwi-engile emalunga ne-120 °, kodwa ukukhanya kokukhanya kubonisa ijika lephiko lelulwane elihla kabukhali embindini, njengenkwenkwezi eqaqambileyo, ekhanya ngokuqaqambileyo kodwa ngandlel’ ithile ithe saa kwaye ingalungelelananga. Ukudibana neukukhanyaiimfuno, kuyimfuneko ukubumba kwakhona ijika lokuhambisa ukukhanya ngoyilo lwesibini lwe-optical design.
Ukusetyenziswa kweelensi ze-TIR kwinkqubo ye-lens inokucinezela i-angle emission ukuya kwi-30 °, kodwa ukulahleka kokusebenza kokukhanya kunokufikelela kwi-15% -20%; I-parabolic reflection kwi-reflector scheme inokwandisa ukukhanya okuphakathi, kodwa iya kuvelisa amabala okukhanya acacileyo; Xa udibanisa ii-LED ezininzi, kuyimfuneko ukugcina isithuba esaneleyo ukuphepha ukungafani kombala, okunokunyusa ubukhulu besibane. Kufana nokuzama ukudibanisa umfanekiso ogqibeleleyo kunye neenkwenkwezi esibhakabhakeni sasebusuku, kodwa kuhlala kunzima ukuphepha iziphene kunye nezithunzi.
I-COB ye-Integrated Architecture
Uyilo oludibeneyo lwe-COB ngokwendalo luneempawu zomphezuluukukhanyaumthombo, njengomnyele oqaqambileyo kunye nokukhanya okufanayo kunye nokuthambileyo.Ulungiselelo lwe-chip eshinyeneyo lwe-Multi lususa iindawo ezimnyama, ezidityaniswe ne-micro lens array technology, zinokufikelela ekukhanyeni okufanayo>85% kumgama we-5m; Ngokucokisa i-substrate surface, i-emission angle inokwandiswa ukuya kwi-180 °, ukunciphisa i-glare index (UGR) ukuya ngaphantsi kwe-19; Ngaphantsi kwe-flux ekhanyayo efanayo, ukwandiswa kwe-COB ye-optical kuncitshiswe nge-40% xa kuthelekiswa noluhlu lwe-LED, lula kakhulu ukuyila ukukhanya.ukukhanyaindawo, ERCO kaThixo COB trackizibaneukufikelela kwi-50: i-1 yokukhanya kwe-illumination ratio kumgama we-projection ye-0.5 yeemitha ngokusebenzisa iilensi ze-free-form, ukusombulula ngokugqibeleleyo ukuphikisana phakathi kokukhanya okufanayo kunye nokugqamisa amanqaku abalulekileyo.
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Isisombululo solawulo lobushushu:into entsha ukusuka ekugxothweni kobushushu bendawo ukuya kwinqanaba lenkqubo yokuqhuba ubushushu
Umthombo wokukhanya we-LED yemveli
Ii-LED zesiNtu zisebenzisa inqanaba le-thermal conduction yenqanaba le-"chip eqinile yenkxaso ye-PCB", kunye nokwakheka kokumelana ne-thermal, okufana nomzila ojikelezayo, othintela ukutshatyalaliswa ngokukhawuleza kobushushu. Ngokubhekiselele kwi-interface yokumelana ne-thermal, kukho ukuxhatshazwa kwe-thermal ye-0.5-1.0 ℃ / W phakathi kwe-chip kunye ne-bracket; Ngokubhekiselele kwizinto ezichasene ne-thermal, i-thermal conductivity yebhodi ye-FR-4 kuphela i-0.3W / m · K, eba yibhotile yokutshatyalaliswa kobushushu; Ngaphantsi kwesiphumo esongezelekayo, ii-hotspots zasekhaya zinokunyusa ubushushu be-junction nge-20-30 ℃ xa ii-LED ezininzi zidityanisiwe.
Idatha yovavanyo ibonisa ukuba xa ubushushu be-ambient bufikelela kwi-50 ℃, izinga lokubola kokukhanya kwe-SMD LED liphindwe kathathu ngokukhawuleza kunolo lwe-25 ℃ yokusingqongileyo, kwaye ubomi bufutshane ukuya kwi-60% ye-L70 standard. Kanye njengokuba sesichengeni ixesha elide kwingqatsini yelanga, ukusebenza kunye nobomi beUkukhanya kwe-LEDumthombo uya kuncitshiswa kakhulu.
Umthombo wokukhanya we-COB
I-COB yamkela uyilo lokuqhuba olunemigangatho emithathu "ye-chip substrate heat sink", iphumeze umtsi kumgangatho wolawulo lobushushu, njengokubeka uhola wendlela obanzi nothe tyabaukukhanyaimithombo, evumela ubushushu ukuba buqhutywe ngokukhawuleza kwaye buchithwe. Ngokubhekiselele kwi-substrate innovation, i-thermal conductivity ye-aluminium substrate ifikelela kwi-2.0W / m · K, kwaye i-aluminium nitride ceramic substrate ifikelela kwi-180W / m · K; Ngokumalunga noyilo olufanayo lobushushu, umaleko wobushushu obufanayo ubekwe phantsi koluhlu lwetshiphu ukulawula umahluko wobushushu ngaphakathi ± 2 ℃; Ikwahambelana nokupholisa ulwelo, kunye nesakhono sokuchitha ubushushu ukuya kuthi ga kwi-100W/cm ² xa isubstrate idibana nepleyiti yokupholisa engamanzi.
Ekusetyenzisweni kwezibane zemoto, umthombo wokukhanya we-Osram COB usebenzisa uyilo lokwahlukana kwe-thermoelectric ukuzinzisa ubushushu be-junction ngaphantsi kwe-85 ℃, ukuhlangabezana neemfuno zokuthembeka kwemigangatho yemoto ye-AEC-Q102, kunye nobomi obungaphezu kweeyure ze-50000. Kanye njengokuqhuba ngesantya esiphezulu, isenokubonelela ngokuzinzileyo kwayeukukhanya okuthembekileyokubaqhubi, ukuqinisekisa ukhuseleko lokuqhuba.
Ithathwe kwi-Lightingchina.com
Ixesha lokuposa: Apr-30-2025